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面向半导体、印刷电路板组装和其他成品设备的机器视觉、深度学习和 3D 解决方案
如今，没有机器视觉就无法生产电子组件和设备。事实上，机器视觉使实现当今高密度集成电路和以低成本制造此类电路成为可能。电子产品制造商依赖康耐视机器视觉、深度学习和 3D 视觉技术制造和检测半导体、印刷电路板、电子硬件、以及消费设备。